(1) High Throughput:5-lane 4500pcs/h; 10-lane 8000pcs/h.

(2) Excellent Uniformity, long bath life time.

(3) Various additives or mixed additives technology.

(4) Wafer thickness handling capability up to 120μm.

(5) Quick inline bath change.

(6) Suitable for rear side polishing and with low chemical consumption.

(7) Suitable with MES ; Inline weight testing is optional.

(8) Compatible with acid polish function.

Please kindly note that the price and payment term shall be negotiable.