ID:20110934461
Category: Metallurgy,Chemicals & Energy Metallurgy and founding
MOQ:1.00 KG
epoxy potting compound epoxy resin and hardener potting compound epoxy encapsulanthigh temperature epoxy resin epoxy resin two part epoxy resin
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SE2213 Two component high termal conductive temperature resistant epoxy potting compound
?Product Description
SE2213 is two-component solvent-free room temperature curing epoxy potting material with excellent adhesion and heat resistance.
?Key Features
1. Excellent adhesion, anti-cracking property
2. Low CTE coefficient of linear expansion
3. Excellent electrical insulating properties, and stability
4. High thermal conductivity, low expansion coefficient
5. Can be used between temperature 150~180°C for long-term
6. Good waterproof, moisture resistance, very low water absorption
?Typical Applications
For encapsulation of electric products which require high thermal conductivity and heat resistance, such as motors, electric reactor, electric tools, instrumentation, automotive electronics etc.

?Technical Data Table
PROPERTY | STANDARD/UNITS | VALUE of SE2213 | |
---- | ---- | PART A | PART B |
Appearance | Visual inspection | Black fluid | Transparent liquid |
Viscosity | 25°C, cps | 20,000±3,000 | 25 |
Density | 25°C, g/cm3 | 2.35±0.05 | 0.93±0.05 |
Mixture ratio | Mass ratio | A:B=100:8 | |
Viscosity of mixture | 25°C, cps | 2,000±300 | |
Density of Mixture | 25°C, g/cm3 | 1.1~1.13 | |
Operation time | 25°C, min | 40 | |
Preliminary Cured | 60°C, min | 60 | |
Hardness | Shore D | 90 | |
Thermal conductivity | W/mK | 1.3 | |
Expansion coefficient | μm/(m, °C) | 20 | |
Glass transition temperature | DSC, °C | 95 | |
Shear strength | MPa, Fe/Fe MPa, Al/Al
| ≥8 ≥8 | |
Dielectric strength | kV/mm, 25°C | ≥18 | |
Loss factor | (1MHz)(25℃) | 0.09 | |
Dielectric constant | 1MHz, 25°C | 2.9 | |
Volume resistance | DC500V, ohm-cm | 1.00E +15 | |
Application temperature | °C | -50~180
| |
Note:Above data was tested under certain conditions, cured in 100°C for 2 hours.
?Directions for Use
1. Stirring A component evenly before taking use.
2. Mix A, B two components with 100:8 mass ratio, stir well and do vacuum defoaming before potting to components.
3. It’s a normal phenomenon of crystallization or agglomeration during the storage of part B, should thaw it by putting it into an 80 °C oven. (To avoid gas expansion and destroy container, the container should be opened.) And then cooled to room temperature to use, this does not affect its performance.
4. If necessary, continue to vacuum defoaming for components which been potted, help to increase the electrical performance of the device.
5. Curing conditions: 25°C/ 24 hours; 80°C/ 3 hours; 100°C/ 2 hours.
?Packing and Storage
SE2213 Black color Part A—20 KG/Metal drum, Part B—0.8 KG/ Pot.
When stored at or below 25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. It’s non-dangerous goods, can be transported and stored as normal chemicals.
?Safety Operation Data
MSDS isn't included here. Please read TDS, MSDS and label carefully before operation. You can get MSDS from SEPNA or other distributors, or mail to service center sepna@sepna.cc, or call +86-400-882-1323.
?Warranty and Liability
All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. SEPNA don't make assurance of any other applications outside the specification until SEPNA supply a special written guarantee. SEPNA is only responsible to replace or refund if this product is defective within the warranty period stated above. SEPNA makes it clear that will not be liable of any accidents.

Business Type:Manufacturer
Online Supplier