ID:20112343359
Category: Metallurgy,Chemicals & Energy Organic & Inorganic Chemicals
MOQ:1.00 KG
silicone sealant two parts silicone sealant potting compound silicone potting compound waterproof potting compound
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SI2230 Two-component thermal conductive flame retardant silicone potting compound
?Product Description
SI2230 is two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standard.
?Key Features
1. Two-part 1:1 mixture addition type silicone adhesive
2. Low hardening shrinkage
3. Excellent electrical insulation in high temperature and stability
4. Good waterproof and moisture resistance
Excellent flame resistance
?Typical Applications
Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.

?Technical Data Table
PROPERTY | STANDARD/UNITS | VALUE of SI2230 | |
---- | ---- | PART A | PART B |
Color | Visual inspection | white / black viscous liquid | white viscous liquid |
Viscosity | 25°C, cps | 3500±500 | 3500±500 |
Density | 25°C, g/cm3 | 1.55±0.05 | 1.55±0.05 |
Mixture ratio | Mass ratio | A:B=100:100 | |
Viscosity of mixture | 25°C, cps | 3500±500 | |
Operation time | 25°C, min | 60±10 | |
Cure condition | RTV/HEAT | 25°C/ 4 hour; 80°C/ 30min | |
Cured appearance | ---- | White/ Gray-black elastomer | |
Hardness | Shore A | 55±5 | |
Thermal conductivity | W/mK | 0.80 | |
Linear expansion coefficient | K-1, ppm | 300 | |
Dielectric strength | kV/mm, 25°C | ≥20 | |
Volume resistance | DC500V, ohm-cm | 1.1×1015 | |
Loss factor | 1 MHz | 0.009 | |
Dielectric constant | 1 MHz | 3.00 | |
Application temperature | °C | -60~200
| |
Flame resistance | UL-94 | V-0 | |
Note:Above operation time and curing time was resulted based on 100g mixture, curing in 25°C, 55%RH for 7 days.
?Directions for Use
1. Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
3. Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.
2. Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
** Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.
** It's hard for SI2230 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.
?Packing and Storage
SI2230 color White/Black Part A--10 KG/Bucket, Part B--10 KG/ Bucket.
When stored at or below 35°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
?Safety Operation Data
MSDS isn't included here. Please read TDS, MSDS and label carefully before operation. You can get MSDS from SEPNA or other distributors, or mail to service center sepna@sepna.cc, or call +86-400-882-1323.

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